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SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
November 26, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
The program includes a dozen presentations on material and process considerations as well as the latest technology developments. Speakers represent a variety of companies from equipment and materials suppliers to defense manufacturers.
This event sets the stage for researchers, engineers, designers and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns.
The City of Peoria is once again the proud Gold Sponsor of this event. Additional sponsorship opportunities are still available for this event. View more details on SMTA's website.
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SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
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PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Technica Demo Days Event Proves to Be Beneficial to Customers
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