Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
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Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
November 26, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
The program includes a dozen presentations on material and process considerations as well as the latest technology developments. Speakers represent a variety of companies from equipment and materials suppliers to defense manufacturers.
This event sets the stage for researchers, engineers, designers and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns.
The City of Peoria is once again the proud Gold Sponsor of this event. Additional sponsorship opportunities are still available for this event. View more details on SMTA's website.
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