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SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
November 26, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
The program includes a dozen presentations on material and process considerations as well as the latest technology developments. Speakers represent a variety of companies from equipment and materials suppliers to defense manufacturers.
This event sets the stage for researchers, engineers, designers and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns.
The City of Peoria is once again the proud Gold Sponsor of this event. Additional sponsorship opportunities are still available for this event. View more details on SMTA's website.
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PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Technica Demo Days Event Proves to Be Beneficial to Customers
08/18/2025 | Technica USATechnica USA’s Demo Days Event, took place August 13–14 at the company’s Demo Center in San Jose, California. The event featured live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.
Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
Strengthening U.S.-Japan Industry Ties
08/11/2025 | Yusaku Kono, Global Electronics Association—East Asia Japan RepresentativeThe Global Electronics Association-East Asia (formerly known as IPC East Asia) hosted a high-level Executive Roundtable in Tokyo on March 5, bringing together more than 50 senior executives, policymakers, and experts from Japan’s electronics and manufacturing sectors.