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Biden-Harris Administration: CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity
November 27, 2024 | U.S. Department of CommerceEstimated reading time: 2 minutes
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on March 20, 2024, and the completion of the Department’s due diligence. The award will directly support Intel’s expected U.S. investment of nearly $90 billion by the end of the decade, which is part of the company’s overall $100+ billion expansion plan. The Department will disburse the funds based on Intel’s completion of project milestones.
“The CHIPS for America program will supercharge American innovation and technology and make our country more secure – and Intel is playing an important role in the revitalization of the U.S. semiconductor industry through its unprecedented investments across Arizona, New Mexico, Ohio, and Oregon,” said U.S. Secretary of Commerce Gina Raimondo. “Thanks to the leadership of President Biden and Vice President Harris, our CHIPS award is enabling Intel to drive one of the most significant semiconductor manufacturing expansions in U.S. history.”
“Today’s award marks another key step in implementing President Biden’s CHIPS and Science Act and the Investing in America agenda to reshore manufacturing, create thousands of good-paying jobs, and strengthen our economy,” said White House Deputy Chief of Staff Natalie Quillian. “Intel’s investments across the country demonstrate once again how President Biden’s Investing in America agenda is delivering for the American people.”
Leading-edge chips power the most sophisticated technology on the planet, including developing AI and building critical military capabilities. Intel’s process technologies, such as Intel 18A and advanced packaging technologies, combined with its foundry services, would strengthen the domestic supply of these advanced chips. The Department’s investment in Intel would support both the fabrication and advanced packaging of leading-edge chips through projects in Arizona, New Mexico, Ohio, and Oregon. As previously announced and with the Department's support, Intel's overall expansion plan is estimated to support approximately 10,000 manufacturing jobs and 20,000 construction jobs across all four states.
“With Intel 3 already in high-volume production and Intel 18A set to follow next year, leading-edge semiconductors are once again being made on American soil,” said Pat Gelsinger, CEO of Intel. “Strong bipartisan support for restoring American technology and manufacturing leadership is driving historic investments that are critical to the country’s long-term economic growth and national security. Intel is deeply committed to advancing these shared priorities as we further expand our U.S. operations over the next several years.”
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New Ultrafast Memory Boosts Intel Data Center Chips
11/19/2024 | IntelWhile Intel’s primary product focus is on the processors, or brains, that make computers work, system memory (that’s DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen).
Infineon, Stellantis to Advance Innovation in Power Conversion and Distribution for Vehicle Architectures
11/08/2024 | InfineonStellantis N.V. and Infineon Technologies AG announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.
CACI Completes Acquisition of Azure Summit Technology
10/31/2024 | BUSINESS WIRECACI International Inc. announced that it has completed its acquisition of Azure Summit Technology, a provider of innovative, high-performance radio frequency (RF) technology and engineering, focused on electromagnetic spectrum, in an all-cash transaction for $1.275 billion.
onsemi East Fishkill Fab Accredited as Trusted Foundry by Department of Defense
10/29/2024 | BUSINESS WIREonsemi announced its wafer fab in East Fishkill (EFK), New York, has been accredited by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense (DoD) as a Category 1A Trusted Supplier.
Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra 200V Series Processors
10/24/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel® Core™ Ultra 200V series.