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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
December 30, 2024 | IPCEstimated reading time: Less than a minute
The Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025.. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
Key Highlights:
- Two Keynotes: Explore the impact of AI and the "Silicon-to-Systems" approach on the future of electronics design.
- 24 Presentations: Hear from renowned experts on the latest advancements in electronics design, including development, design for excellence, software and tools, and the design process of electronic systems.
- Two Expert Panels: Engage in insightful discussions on AI in electronics and the product life cycle.
- Networking Reception: Connect with industry leaders, researchers, and fellow designers.
- PEDC offers a unique opportunity for PCB designers to gain cutting-edge knowledge, expand their professional network, and explore the future of electronics design.
For more information, visit pedc.eu.
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