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Camtek Ltd., announced that it has received over $50 million in initial orders from several customers for its new Hawk product, with additional orders in the pipeline. These orders will be delivered throughout 2025.
The Hawk, based on a groundbreaking new platform, addresses high-end Advanced Packaging technologies including capabilities for inspection and 3D measurements of wafers with 500 million micro bumps and Hybrid Bonding technology. Offering significantly enhanced capabilities beyond the Eagle product line, the Hawk expands Camtek’s total addressable market (TAM).
The Hawk product line addresses the industry’s most demanding applications, including High Bandwidth Memory (HBM), Chiplet and Hybrid Bonding as well as use-cases previously unserved by Camtek. With unmatched throughput and precision, the Hawk platform is engineered to meet current and future industry roadmaps, setting a new benchmark for inspection and metrology.
The Hawk will be officially launched in February 2025 at Semicon Korea.
Rafi Amit, Camtek’s CEO commented, “Our new Hawk product line is an important addition to Camtek’s portfolio and we are very pleased with the strong initial customer reception, as reflected by the over $50 million in orders received even before the official launch. These orders for the Hawk highlight the strong demand in the market for these solutions and reflect our customer’s confidence in Camtek’s products.”
Continued Mr. Amit: “Together with the new, recently unveiled, Eagle G5 model, and the thousands of Eagle systems already installed at customer sites, we continue to address the variety of applications of our customers around the world. We remain committed to supporting our customers as we continue to deliver cutting-edge solutions.”
