Fresh PCB Concepts: Traceability in PCB Design
The Shaughnessy Report: Back to the Future
Designers Notebook: Addressing Future Challenges for Designers
SMT007 Magazine Explores Soldering Technologies—December 2024
December 2, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
In the December 2024 issue of SMT007 Magazine, we explore some of the emerging soldering technologies: photonic, vacuum reflow and condensation soldering. And our columnists deep-dive into advanced packaging and international trade.
Learn more in this month’s issue of SMT007 Magazine.
Share on:
Suggested Items
SolderKing Doubles Facility to Meet Growing Demand
02/18/2025 | SolderKingSolderKing, a leading UK manufacturer of soldering materials, has expanded its operations by doubling its facility. The move follows a significant rise in export sales throughout 2024 and reinforces the company’s position as a key supplier of regulatory-compliant soldering solutions across the UK and Europe.
SEHO to Highlight Cutting-Edge Soldering Technology at IPC APEX Expo 2025
02/17/2025 | SEHOSEHO, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is thrilled to present its best-selling selective soldering system SEHO SelectLine-C at the IPC APEX Expo 2025 in Anaheim.
Bridging the Gap: Workforce Collaboration in East Texas
02/13/2025 | Cory Blaylock, IPCIPC has partnered with Stephen F. Austin State University's (SFASU) Center for Applied Research and Rural Innovation (CARRI) and the IPC Education Foundation on a transformative project aimed at aligning academic training with real-world demands in electronics manufacturing.
Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025
02/11/2025 | Rehm Thermal SystemsRehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in