It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
December 2, 2024 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
Whitepaper Abstract:
Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes. Standard materials like epoxies, adhesives, or solder pastes are most often used in the die attach process. However, it is critical to remove any flux residues left behind after soldering before proceeding with wire bonding and molding to ensure maximum yield in packages that use solder paste for die attachment. One of the most widely used cleaning agents to remove flux residues is isopropyl alcohol (IPA). While IPA is commonly used as a general cleaner in the electronics industry, it is not the most effective solution for flux removal.
Semiconductor package manufacturers produce millions of units daily and therefore, a small improvement in the wire bonding yield can significantly impact production efficiency and the overall product costs.
One such OEM was producing lead frame packages and using IPA (Isopropyl alcohol) in the ultrasonic cleaning process. However, their process resulted in a wire bonding yield of only 98%, measured after the molding and deflashing processes. This indicated significant motivation to improve the cleaning process and the wire bonding yield.
A Design of Experiment (DOE) was developed to assess alternative cleaning agents and process equipment, aiming to optimize the cleaning process and to be evaluated based on the improvement in wire bonding yield. Process qualification was conducted through a pull test according to the MIL-STD-883E method 2011.7. Throughout the DOE process iterations, process improvements were identified through visual inspection, pull and shear testing as well as overall yield measurement from the wire bonding process.
Share on:
Suggested Items
Sartorius Lab Instruments GmbH & Co. KG, First German EMS Company to Receive IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing
03/10/2025 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Sartorius Lab Instruments GmbH & Co. KG. Sartorius is a leading international provider to the biopharmaceutical research and medical industry.
Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
03/10/2025 | MulticircuitsMike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025
03/10/2025 | Koh YoungKoh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.
RTX's Collins Aerospace Unveils New Engineering Development and Test Center in Bengaluru
03/10/2025 | RTXCollins Aerospace, an RTX business, opened its new Engineering Development and Test Center (EDTC) at the company’s North Gate campus in Bengaluru, India. The new facility streamlines product development, testing, and certification of components locally, bringing aerospace technologies to market faster.
New Version of the Machine Vision Software MVTec MERLIC Focuses on Easier Integration
03/07/2025 | MVTecWith MVTec MERLIC, complex machine vision tasks can be solved quickly and intuitively – even without programming knowledge. The new version focuses on simpler integration of MERLIC into machine control systems.