It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
Case Study: PCB Design Flaws Affect Product Cost
December 3, 2024 | Matt Stevenson, ASC SunstoneEstimated reading time: 1 minute
In the rapidly evolving aerospace industry, precision and reliability are paramount. “AeroTech Solutions” (not the company’s real name), an aerospace company specializing in satellite technology, recently faced a significant challenge that tested its operational integrity: A flaw identified in the PCB design of its latest satellite model led to unexpected delays and cost overruns. This article explores the issues the company encountered, its collaboration with its PCB manufacturer to resolve these challenges, and the steps taken to ensure project success moving forward. The real cost to manufacture can be greatly affected at the PCB design level.
AeroTech Solutions has built a reputation for innovation and excellence in the aerospace technology market. With numerous successful satellite projects under its belt, the company was poised to launch its newest satellite designed for advanced communications and earth monitoring. However, during the final stages of production, the engineering team detected a flaw in the PCB design which was causing functional failures and putting the satellite’s operational functionality at risk.
The Issue: PCB Design Flaw
The PCB design flaw was identified during the final test stage of the prototype PCBA. Engineers kept finding assemblies that showed the flaw at various levels throughout the testing phases, and finally identified the root cause during final test. They discovered that the designer had overlooked critical routing on a very sensitive portion of the design. That created issues with the clean transfer of the signal and created isolated overheating. This led to delamination and jeopardized the satellite’s mission objectives.
To read the entire case study, which originally published in the November 2024 PCB007 Magazine, click here.
Share on:
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.