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Case Study: PCB Design Flaws Affect Product Cost
December 3, 2024 | Matt Stevenson, ASC SunstoneEstimated reading time: 1 minute
In the rapidly evolving aerospace industry, precision and reliability are paramount. “AeroTech Solutions” (not the company’s real name), an aerospace company specializing in satellite technology, recently faced a significant challenge that tested its operational integrity: A flaw identified in the PCB design of its latest satellite model led to unexpected delays and cost overruns. This article explores the issues the company encountered, its collaboration with its PCB manufacturer to resolve these challenges, and the steps taken to ensure project success moving forward. The real cost to manufacture can be greatly affected at the PCB design level.
AeroTech Solutions has built a reputation for innovation and excellence in the aerospace technology market. With numerous successful satellite projects under its belt, the company was poised to launch its newest satellite designed for advanced communications and earth monitoring. However, during the final stages of production, the engineering team detected a flaw in the PCB design which was causing functional failures and putting the satellite’s operational functionality at risk.
The Issue: PCB Design Flaw
The PCB design flaw was identified during the final test stage of the prototype PCBA. Engineers kept finding assemblies that showed the flaw at various levels throughout the testing phases, and finally identified the root cause during final test. They discovered that the designer had overlooked critical routing on a very sensitive portion of the design. That created issues with the clean transfer of the signal and created isolated overheating. This led to delamination and jeopardized the satellite’s mission objectives.
To read the entire case study, which originally published in the November 2024 PCB007 Magazine, click here.
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I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
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Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.