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SEMICON China 2025 to Highlight Key Opportunities and Challenges in Advancing Semiconductor Industry Growth

03/07/2025 | SEMI
SEMICON China 2025 will gather industry visionaries and leaders from March 26-28 at the Shanghai New International Expo Centre to delve into the latest developments, trends, and innovations in key areas crucial for propelling industry growth to $1 trillion by 2030.

Würth Elektronik Renews Strategic Partnership with Centech in Montreal

03/07/2025 | Würth Elektronik
Würth Elektronik, a global leader in electronic and electromechanical components, is proud to announce an additional two-year partnership with Centech, a renowned university business incubator based in Montreal, Canada..

Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO

03/06/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing solutions, is pleased to announce two key leadership updates to its executive team.

Lockheed Martin's LM 400 Tech Demo to Prove Out Design and Risk Reduction Efforts

03/06/2025 | Lockheed Martin
The latest self-funded technology demonstration from Lockheed Martin (NYSE: LMT) is ready to launch no earlier than March 15.

UHDI Fundamentals: UHDI Advances Neurotechnology

03/05/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.
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