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Suggested Items

Connect the Dots: Total Value Manufacturing Solutions

07/30/2026 | Matt Stevenson -- Column: Connect the Dots
In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total value management prizes customer focus, continuous improvement, and employee empowerment.

Book Excerpt: The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings, Chapter 4

07/30/2026 | Brian J. Chislea and Cody Schoener, PhD, Dow, Inc.
Sustainability and reliability in electronics mean efficient manufacturing and durable devices that reduce waste and the need for frequent replacements. Choosing energy-efficient, low-solvent, fast-processing materials supports these goals. Case studies are presented in Chapter 4 of "The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings" that evaluate costs, energy use, materials, space, time, and overall savings.

Below the Surface: Ceramic vs. PCB—When ‘Good Enough’ Becomes System Failure

07/28/2026 | Chandra Gupta -- Column: Below the Surface
Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

Connect the Dots: PCB Manufacturing Focused on Value

06/29/2026 | Matt Stevenson -- Column: Connect the Dots
PCB manufacturing has become more complex, not only to meet the growing need for more advanced, smaller boards, but also to address supply chain disruptions and uncertainty about the cost of critical raw materials. This environment makes it harder for our customers, too. Relatively straightforward decisions about choosing a PCB manufacturer have become more challenging.

Right-sizing Silver: An Application-driven Approach to Engineering Reliability

06/24/2026 | Ebad Rehman, MacDermid Alpha Electronics Solutions
Rising cost pressure and metals market uncertainty are prompting manufacturers to rethink alloy composition to balance total cost of ownership, process yield, and mechanical performance. Solder alloy selection directly influences cost structure, process stability, and long‑term reliability in electronics assembly. As manufacturing scales and product requirements advance, these decisions are increasingly revisited with a more focused objective: aligning materials with how products are built, processed, and used in real‑world conditions.
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