-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
2024 IPC K-FEST: Shaping the Future of the Electronics Industry
December 6, 2024 | IPCEstimated reading time: 2 minutes
IPC K-FEST 2024, the 2nd annual IPC Korea Festival of Electronics Standards and Technology, was held in Seoul on October 29. The focus of this year’s event centered on the integration of Korea's technological leadership with international standards development.
The conference attracted160 industry professionals from approximately 80 companies. This one-day event featured technical seminars, an IPC-A-610 regional task group meeting, and the IPC Korea Annual Awards as key highlights. IPC Asia President Sydney Xiao and IPC Board member, Jae-sang Min, LG Electronics, gave welcome speeches to open the event.
Technical seminars focused on addressing challenges in the electronics manufacturing industry, demonstrating how IPC standards enhance manufacturing performance and quality. Participants engaged in active discussions across seven topics: Digitalization of Electronics Manufacturing – Towards Smart Factory enabling Industry 4.0; Mastering Challenges in Electronics for Electric Vehicles; Evaluation and Prediction of MLCC Ionic Migration in Electronics; Material Selection and Technical Solution of Conformal Coating; Improving Performance and Reliability at PCB Design Phase, Requirements and Acceptance Specifications for Organic Packaging Substrates, and the Relationship of Sn Plating and IMC at PCBA.
During the awards luncheon, IPC Korea staff awarded various individual volunteers. Rounding out the day, the IPC-A-610 regional task group meeting was held, which aimed to involve more Korean engineers into IPC’s global standardizations activities.
Jae-sang Min, IPC Board member, highly praised the achievements made by the IPC Korea team since 2021. “Although currently there are not many Korean people participating in IPC standardization compared with Korea's leading position in the electronics industry and the importance of IPC in the electronics industry, I believe that in the near future, the IPC Korea team, through platforms such as IPC K-FEST, will surely lead more and more Korean electronics manufacturing companies and experts to the world standardization stage,” he stated.
The Korean Government project, “De-facto Standard Forum” sponsored this event and Jong-won Kwon, general project director of the De-facto Standard Forum said, “IPC K-FEST is exactly the kind of event that we are expecting to see. We, the Korean De-facto Standard Forum, would like to support IPC as much as we can.” MacDermid Alpha Electronics Solutions and K&P Co., Ltd. sponsored supplies for this event.
“My special thanks go to the IPC Korea team and IPC Korea Advisory Committee for their dedication in making this event possible. We are confident that it will continue to attract greater interest from Korea’s industry, potentially evolving into a global event, and thus promoting more industry experts to participate in the development of IPC standards,” said Sydney Xiao, IPC Asia president.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
04/27/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.