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Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
December 9, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: Less than a minute
The electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.
In response to these challenges, two industry leaders—iNEMI (International Electronics Manufacturing Initiative) and IPC—joined forces. Their collaboration aims to identify and address key circularity challenges in electronics manufacturing. This initiative gained momentum following a successful workshop at the Electronics Goes Green (EGG) conference in Berlin on June 17, 2024, setting the stage for a series of focused efforts to tackle the industry's most pressing circularity issues.
Key Challenges
The collaboration between iNEMI and IPC has identified four primary areas of focus in addressing circularity challenges.
Read more about these challenges in the Fall 2024 issue of IPC Community.
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Brent Fischthal - Koh YoungSuggested Items
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
10/21/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has received an order from U.S. Customs and Border Protection (CBP) for 15 of its Griffin™ G510x portable chemical detectors, specifically designed to analyze and identify explosives and narcotics, such as fentanyl and nitazenes, within five minutes.
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.