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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
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The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
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Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
December 9, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: Less than a minute
The electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.
In response to these challenges, two industry leaders—iNEMI (International Electronics Manufacturing Initiative) and IPC—joined forces. Their collaboration aims to identify and address key circularity challenges in electronics manufacturing. This initiative gained momentum following a successful workshop at the Electronics Goes Green (EGG) conference in Berlin on June 17, 2024, setting the stage for a series of focused efforts to tackle the industry's most pressing circularity issues.
Key Challenges
The collaboration between iNEMI and IPC has identified four primary areas of focus in addressing circularity challenges.
Read more about these challenges in the Fall 2024 issue of IPC Community.
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EIPC Technical Snapshot: Factors Driving the Fluctuating Demand for PCBs
12/11/2024 | Pete Starkey, I-Connect007EIPC continued its series of online Technical Snapshots with a webinar on Nov. 21 presented by Dr. Hayao Nakahara of N.T. Information Ltd, who summarised world PCB production and shared his vision of the market over the next five years. With information gathered from many sources, Nakahara examined factors driving the increasing demand for printed circuit boards.
Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
ADCO Circuits Demonstrates Leading Cybersecurity Resilience for the PCBA Industry
12/11/2024 | ADCO CircuitsAdco Circuits, a Michigan-based electronics assembler, has reinforced its unyielding commitment to national security by achieving SensCy Score™ 800+ Club status, with a score of 873.