Sondrel Now Shipping Chips as Part of a Complete Turnkey Project
December 9, 2024 | SondrelEstimated reading time: 2 minutes
Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which is one of Sondrel’s speciality areas as it requires high performance, ultra-complex custom designs on leading edge nodes.
“Selecting a turnkey supplier to handle a complete ASIC project is much more challenging than just selecting an ASIC design house,” explained Ollie Jones, Sondrel’s CEO. “There needs to be a high level of confidence and trust. Fortunately, we have an excellent reputation for designing ultra-complex custom chips that has been built up over the past twenty years and customers come to us for that service. As a result, customers know that we are detail-oriented and also want us to take care of all the many stages downstream in the complex supply chain, in addition to design.
“We invest time right at the initial engagement to ensure that the customer fully understands every aspect of the whole turnkey process and how we would handle it. With every such turnkey project, the customer will know that this will be a proper partnership with personal service, full transparency and regular dialogues at every stage, unlike some companies who expect the customer to adapt to the ways that they want to do things with very little customer interaction.”
A key example of Sondrel’s expertise in the supply chain was the critical question of packaging lead times. At the time when the project was being negotiated, packaging lead times were around 42 weeks, but Sondrel’s knowledge of the market trends and well-established contacts with its regular packaging companies meant that it was able to confidently offer packaging times for this project of 12 to 16 weeks at the relevant point in the project’s timeline. This is because Sondrel is managing the entire supply chain and therefore has a precise view of the timeline for every stage and can book packaging slots well in advance. “We were also able to identify the exact specialist packaging required as it had to have an ultra-low profile of only 2.5mm,” added Ollie Jones. “Knowing that a flip-chip CSP package would be required, we had already booked the time and the resources for this at the packaging company to ensure that the project was on schedule.”
Suggested Items
Xanadu Opens $10M Advanced Photonic Packaging Facility in Ontario
06/25/2025 | PRNewswireXanadu, a world leader in photonic quantum computing, has opened a $10M world-leading advanced photonic packaging facility in Toronto. This facility represents a significant leap in Canada's quantum supply chain resilience and technical capacity.
KYZEN to Feature MICRONOX Semiconductor Grade Cleaning Chemistries at CHIPcon 2025
06/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the CHIPLET and Heterogeneous Integration Packaging Conference and Exhibition, or CHIPcon, scheduled to take place July 7-10 at the San Jose Marriott
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
06/18/2025 | NHanced SemiconductorsAt the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements
06/12/2025 | SEMIThe MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.