Sondrel Now Shipping Chips as Part of a Complete Turnkey Project
December 9, 2024 | SondrelEstimated reading time: 2 minutes
Sondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which is one of Sondrel’s speciality areas as it requires high performance, ultra-complex custom designs on leading edge nodes.
“Selecting a turnkey supplier to handle a complete ASIC project is much more challenging than just selecting an ASIC design house,” explained Ollie Jones, Sondrel’s CEO. “There needs to be a high level of confidence and trust. Fortunately, we have an excellent reputation for designing ultra-complex custom chips that has been built up over the past twenty years and customers come to us for that service. As a result, customers know that we are detail-oriented and also want us to take care of all the many stages downstream in the complex supply chain, in addition to design.
“We invest time right at the initial engagement to ensure that the customer fully understands every aspect of the whole turnkey process and how we would handle it. With every such turnkey project, the customer will know that this will be a proper partnership with personal service, full transparency and regular dialogues at every stage, unlike some companies who expect the customer to adapt to the ways that they want to do things with very little customer interaction.”
A key example of Sondrel’s expertise in the supply chain was the critical question of packaging lead times. At the time when the project was being negotiated, packaging lead times were around 42 weeks, but Sondrel’s knowledge of the market trends and well-established contacts with its regular packaging companies meant that it was able to confidently offer packaging times for this project of 12 to 16 weeks at the relevant point in the project’s timeline. This is because Sondrel is managing the entire supply chain and therefore has a precise view of the timeline for every stage and can book packaging slots well in advance. “We were also able to identify the exact specialist packaging required as it had to have an ultra-low profile of only 2.5mm,” added Ollie Jones. “Knowing that a flip-chip CSP package would be required, we had already booked the time and the resources for this at the packaging company to ensure that the project was on schedule.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
09/08/2025 | ASMPTASMPT, the world's leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions
09/01/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei City.