Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/13/2024 | Andy Shaughnessy, I-Connect007
This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.

EIPC Technical Snapshot: Factors Driving the Fluctuating Demand for PCBs

12/11/2024 | Pete Starkey, I-Connect007
EIPC continued its series of online Technical Snapshots with a webinar on Nov. 21 presented by Dr. Hayao Nakahara of N.T. Information Ltd, who summarised world PCB production and shared his vision of the market over the next five years. With information gathered from many sources, Nakahara examined factors driving the increasing demand for printed circuit boards. 

China Captures 61% of Global EV Traction Inverter Installation Volume in 3Q24, Europe Pushes Reforms to Rebound

12/10/2024 | TrendForce
TrendForce’s latest findings show that global shipments of EV traction inverters reached 6.87 million units in the third quarter of 2024, representing a 7% QoQ increase, though the growth rate has slowed compared to the same period last year.

Low-Altitude Aviation’s Untapped Market Expected to Drive Solid-State Battery Demand to 302 GWh by 2035

12/04/2024 | TrendForce
TrendForce’s latest investigations reveal that the development of flying cars and electric vertical take-off and landing aircraft (eVTOL)/urban air mobility (UAM) vehicles are positioning solid-state batteries as a key energy technology for low-altitude aviation.

Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in