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Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem

01/13/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

01/09/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.

Eighteen New Semiconductor Fabs to Start Construction in 2025

01/08/2025 | SEMI
The semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab Forecast report. T

Global Semiconductor Sales Increase 20.7% Year-to-Year in November

01/08/2025 | SIA
The Semiconductor Industry Association (SIA) announced global semiconductor sales hit $57.8 billion during the month of November 2024, an increase of 20.7% compared to the November 2023 total of $47.9 billion and 1.6% more than the October 2024 total of $56.9 billion. Monthly sales are compiled by the World Semiconductor.
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