-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
December 11, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
The final incentives, part of the CHIPS and Science Act, solidify support for Micron’s memory chip production facilities in Idaho and New York. Additionally, the Commerce Department announced $275 million in preliminary incentives to expand Micron’s manufacturing facility in Manassas, Virginia, further accelerating semiconductor manufacturing capabilities in the U.S.
“These critical incentives underscore the transformative impact of the CHIPS and Science Act in driving domestic semiconductor production and innovation to ultimately enhance supply chain resilience and American competitiveness,” said Neuffer. “Memory is a technology critical to America’s economic future and national security, and Micron’s historic investments in producing memory chips in the U.S. will strengthen U.S. leadership for the long term. We commend Micron for its forward-looking investments in Idaho, New York, and Virginia, and we applaud the Department of Commerce for its steadfast commitment to strengthening America’s leadership in chip manufacturing. Together, these efforts will create high-paying American jobs, bolster U.S. national and economic security, and fuel innovation for years to come.”
The CHIPS Act has spurred significant investments across the domestic semiconductor industry, with more than 90 new projects announced in 28 U.S. states since its introduction, totaling hundreds of billions in private investments. These projects are expected to generate over 58,000 jobs directly within the semiconductor ecosystem and support hundreds of thousands of additional jobs throughout the U.S. economy.
The finalized incentives for Idaho and New York build upon a preliminary agreement announced in April 2024, while the new agreement for the Manassas expansion represents a pivotal step in advancing U.S. semiconductor manufacturing capacity.
Suggested Items
SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth
01/14/2025 | SEMIIndustry Strategy Symposium (ISS) 2025 sessions open gathering semiconductor industry executives for analysis of growth projections and pivotal business trends for the year ahead.
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
01/13/2025 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
01/10/2025 | MicronMicron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
01/09/2025 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
Eighteen New Semiconductor Fabs to Start Construction in 2025
01/08/2025 | SEMIThe semiconductor industry is expected to start 18 new fab construction projects in 2025*, according to SEMI’s latest quarterly World Fab Forecast report. T