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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
December 11, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
CW-807RS is a no-clean formula designed to maximize the solderability of a halogen-free cored wire solder flux. It is an upgraded version of Indium Corporation’s CW-807 formula, which has been popular with electronics assemblers and other customers for many years. This new halogen-free version will provide improved wetting speeds and contains the company’s industry-leading spatter control technology.
Halogen-free CW-807RS delivers several benefits to users, including:
- Faster wetting speeds
- Clear residues for electronics assemblers that use high (>385°C) tip temperatures and tend to experience charring and tip build-up
- Improving cycle times in robotic soldering applications
“The improved wetting and spatter performance make CW-807RS an excellent no-clean, high-reliability flux-cored wire option for many of our customers, especially in robotic soldering applications,” said Robert McKerrow, Product Manager for Flux-Cored Wire, Wave Solder Flux, and Bar Solder at Indium Corporation. “We’re excited to now offer this solution, combining cutting-edge innovation with proven technology to meet the needs of our customers.”
CW-807RS provides exceptional benefits in manual and robotic soldering applications requiring an “L” IPC classification and halogen-free wire, as well as in manual and robotic soldering applications requiring extra wetting power to achieve higher throughput while remaining halogen-free. Additionally, the spatter control technology within the flux produces an aesthetically pleasing board post-soldering by leaving minimal spattering and a clear to light-colored residue.
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.