-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules
December 11, 2024 | Saki Corp.Estimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series. This advanced X-ray automated inspection system is designed to ensure the highest manufacturing quality of increasingly compact and slim power modules. The 3XI-M200v3 delivers high-speed and high-precision inspections of power modules equipped with heat sinks. Featuring a large X-ray camera and optimized image processing algorithms, the 3Xi-M200v3 achieves three times the resolution of its predecessors while reducing inspection times by up to 50%. This makes it the ideal solution for manufacturing processes for compact, thin power modules, which are increasingly demanded for applications such as electric vehicles (EVs) and data centers.
Driven by global decarbonization efforts, EVs and data center applications increasingly demand greater energy efficiency, fueling the rapid expansion of power module production. These applications demand exceptional manufacturing quality and safety within confined spaces, alongside improved cooling and energy efficiency. Consequently, there is a strong push for compact and slim designs in power modules. To meet these demands, manufacturers are adopting advanced technologies like 3D packaging and double-sided cooling in power module design. However, the trend toward smaller, thinner power modules presents challenges for X-ray inspection, such as achieving sufficient contrast and minimizing interference from overlapping layers.
The new 3Xi-M200v3 rises to the challenge with its large, highly sensitive detector, which captures high-contrast images of even ultra-thin materials. Enhanced CT computation capabilities deliver threefold resolution improvements while cutting inspection times in half compared to previous models. These advancements allow precise separation of multi-layer components within complex power modules, delivering high-resolution images for faster and more accurate inspections.
The 3Xi-M200v3 is designed to optimize overall production efficiency. It features dedicated operator judgment software tailored for power module inspection, streamlining final inspection processes. Fully compliant with the SEMI SECS/GEM standards, the system supports automation and workforce reduction initiatives, aligning with the goals of smart factory implementation.
“We are proud to introduce the 3Xi-M200v3, a testament to Saki’s relentless pursuit of innovation,” said Norihiro Koike, President and CEO of Saki Corporation. “As the manufacturing landscape evolves, our customers face increasingly complex challenges, including the demand for smaller, more efficient, and highly reliable power modules. The 3Xi-M200v3 embodies our commitment to providing cutting-edge solutions that not only enhance product quality but also improve operational efficiency and drive sustainability across industries. At Saki, we see ourselves not just as technology innovators but as partners in progress, enabling our customers to lead in their respective markets and contribute to a more sustainable future.”
Suggested Items
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.
PTCRB Certification Adds New IoT Chipset Certification Category, Certifies Sony's Altair ALT1350 CTIA Certification
04/23/2025 | PRNewswireCTIA Certification announced the first PTCRB certified IoT chipset, Sony's Altair ALT1350.
Flex Wins Two 2025 PACE Awards for Innovation in Automotive Compute and Power Electronics
04/22/2025 | PRNewswireFlex was named a two-time 2025 Automotive News PACE Award winner at the awards ceremony on April 15, recognized for its industry-leading Jupiter Compute Platform and Backup DC/DC Converter design platforms.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.