The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules
December 11, 2024 | Saki Corp.Estimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series. This advanced X-ray automated inspection system is designed to ensure the highest manufacturing quality of increasingly compact and slim power modules. The 3XI-M200v3 delivers high-speed and high-precision inspections of power modules equipped with heat sinks. Featuring a large X-ray camera and optimized image processing algorithms, the 3Xi-M200v3 achieves three times the resolution of its predecessors while reducing inspection times by up to 50%. This makes it the ideal solution for manufacturing processes for compact, thin power modules, which are increasingly demanded for applications such as electric vehicles (EVs) and data centers.
Driven by global decarbonization efforts, EVs and data center applications increasingly demand greater energy efficiency, fueling the rapid expansion of power module production. These applications demand exceptional manufacturing quality and safety within confined spaces, alongside improved cooling and energy efficiency. Consequently, there is a strong push for compact and slim designs in power modules. To meet these demands, manufacturers are adopting advanced technologies like 3D packaging and double-sided cooling in power module design. However, the trend toward smaller, thinner power modules presents challenges for X-ray inspection, such as achieving sufficient contrast and minimizing interference from overlapping layers.
The new 3Xi-M200v3 rises to the challenge with its large, highly sensitive detector, which captures high-contrast images of even ultra-thin materials. Enhanced CT computation capabilities deliver threefold resolution improvements while cutting inspection times in half compared to previous models. These advancements allow precise separation of multi-layer components within complex power modules, delivering high-resolution images for faster and more accurate inspections.
The 3Xi-M200v3 is designed to optimize overall production efficiency. It features dedicated operator judgment software tailored for power module inspection, streamlining final inspection processes. Fully compliant with the SEMI SECS/GEM standards, the system supports automation and workforce reduction initiatives, aligning with the goals of smart factory implementation.
“We are proud to introduce the 3Xi-M200v3, a testament to Saki’s relentless pursuit of innovation,” said Norihiro Koike, President and CEO of Saki Corporation. “As the manufacturing landscape evolves, our customers face increasingly complex challenges, including the demand for smaller, more efficient, and highly reliable power modules. The 3Xi-M200v3 embodies our commitment to providing cutting-edge solutions that not only enhance product quality but also improve operational efficiency and drive sustainability across industries. At Saki, we see ourselves not just as technology innovators but as partners in progress, enabling our customers to lead in their respective markets and contribute to a more sustainable future.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/24/2025 | Andy Shaughnessy, I-Connect007This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
PDN Optimization: Balancing Performance and Cost in SoC Designs
10/22/2025 | Zach Caprai. Siemens EDAThis article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Beyond Design: The Fundamental Structure of Spectral Integrity
10/21/2025 | Barry Olney -- Column: Beyond DesignImpedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/20/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.