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Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024
December 12, 2024 | TPCAEstimated reading time: Less than a minute
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%. This growth was primarily driven by the peak season effect, the mild recovery of mainstream terminal products, and the increasing demand for high-performance circuit boards in AI infrastructure and low-orbit satellite applications.
While the fourth quarter may face challenges due to slower-than-expected smartphone sales and global economic uncertainties, the overall output value for 2024 is still projected to reach NT$808.3 billion, a 5% year-over-year increase. The rising demand for AI edge devices and the alleviation of inflationary pressures are expected to drive further growth in the PCB industry in 2025.
In terms of product segments, multilayer boards, flexible boards, HDI boards, and IC substrates continue to be key drivers. The demand for high-performance circuit boards, particularly for AI and 5G applications, is expected to remain strong.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.