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Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024
December 12, 2024 | TPCAEstimated reading time: Less than a minute
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%. This growth was primarily driven by the peak season effect, the mild recovery of mainstream terminal products, and the increasing demand for high-performance circuit boards in AI infrastructure and low-orbit satellite applications.
While the fourth quarter may face challenges due to slower-than-expected smartphone sales and global economic uncertainties, the overall output value for 2024 is still projected to reach NT$808.3 billion, a 5% year-over-year increase. The rising demand for AI edge devices and the alleviation of inflationary pressures are expected to drive further growth in the PCB industry in 2025.
In terms of product segments, multilayer boards, flexible boards, HDI boards, and IC substrates continue to be key drivers. The demand for high-performance circuit boards, particularly for AI and 5G applications, is expected to remain strong.
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The Marketing Minute: Cracking the Code of Technical Marketing
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EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.