-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
December 16, 2024 | SCHMID GroupEstimated reading time: 2 minutes
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition. With more than 40 years of experience in horizontal electroless Cu processes for high-end PCB and SLP applications, SCHMID combines this legacy with extensive know-how from the advanced packaging industry.
The InfinityLine H+ overcomes the disadvantages of widely used vertical batch processes by introducing newly developed horizontal inline process modules, add-on processes, and an optimized transport system. This latest advancement underscores SCHMID’s dedication to delivering cutting-edge solutions tailored to the evolving needs of manufacturers.
The upgraded InfinityLine H+ achieves highly uniform Cu deposition and features innovative enhancements, including an ozone module for pristine surface preparation, an advanced electroless copper module design, and a revolutionary three-point transport system that eliminates contact with active areas. These innovations empower manufacturers to achieve unprecedented yields in metallization processes while unlocking new technological capabilities.
Each panel is automatically treated under identical process conditions using highly efficient flood boxes that precisely target treatment areas—a significant advantage over traditional vertical basket systems. The horizontal process enhances the uniformity of copper thickness and provides superior performance in rinsing and drying substrate panels. Combined with the state-of-the-art SCHMID Watch 3.0 HMI and process control system, which leverages the decentralized H+ bus system for active and passive components, the InfinityLine H+ offers a smarter and more sustainable production solution.
"The new InfinityLine H+ Electroless Cu exemplifies our steadfast commitment to innovation," said Laurent Nicolet, Vice President of Business Units Electronics. "Compared to vertical batch applications, we achieve more uniform Cu deposition with high adhesion, even on low- roughness ABF materials. By reinventing key system components, the horizontal processing advantages are now accessible to the substrate industry. Together with our proven H+ modular platform, this system offers a more advanced, smarter, and sustainable solution for advanced substrate production, perfectly aligning with current and future manufacturing needs."
Key Features of the Updated InfinityLine H+
1. Ozone Module for High-Adhesion Depositions
- Integrated Gas and Wet Module Design: Streamlined and user-friendly for optimized operation.
- Direct Ozone Application: Delivers ozone precisely where needed, ensuring surface cleanliness with heavily ozone-loaded water treatment.
- Organic Contamination Removal: Efficiently eliminates organic residues without chemically altering or damaging substrate surfaces.
2. Three-Point Tenting Transport System for Handling a Wide Range of Materials
- Gentle Floating Centering: Maintains precise substrate alignment within immersion zones while protecting surfaces.
- No Centering Station Required: Prevents surface damage, enhancing product quality.
- Contactless Transport: Employs newly developed rollers alongside high- performance tenting rollers for safe and controlled substrate movement, eliminating uncontrolled copper deposition.
3. Enhanced Electroless Copper Module for Highly Uniform and Particle-Free Cu Deposition
- Vacuum-Formed Tank Base: Allows for easy cleaning, efficient draining, and eliminates dead spots or chemical deposits.
- Optimized Bath Dynamics: Air injection in tank corners prevents unwanted copper deposits, even in stand-by mode, while reduced bath volumes support faster startups.
- Advanced Dosing and Flow Monitoring: Ultrasonic flow meters, precise dosing mechanisms, and adjustable flood boxes ensure high process stability and reduced chemical consumption.
- Complete Accessibility: Enhanced design simplifies maintenance and ensures efficient operation.
- Improved Draining Mechanism: Prevents unintended plating and facilitates seamless chemical flow.
The upgraded InfinityLine H+ Electroless Cu is designed to meet the needs of industries utilizing SAP and mSAP processes, addressing the growing demand for advanced package applications with superior efficiency and reliability.
Suggested Items
Ather Energy, Infineon Technologies Partner to Accelerate India’s Electric Two-wheeler Revolution
05/30/2025 | InfineonAther Energy, a leading electric two-wheeler manufacturer in India and Infineon Technologies Asia Pacific Pte Ltd, a global leader in semiconductor solutions, signed a Memorandum of Understanding (MoU) in Seoul, South Korea, to jointly drive innovation in the electric vehicle (EV) industry in India.
OSI Systems Receives $47 Million Services Order for Security Inspection Systems
05/30/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a $47 million order from a U.S. based customer to provide ongoing maintenance service for its installed base of Rapiscan® inspection systems that are utilized for screening baggage, cargo and vehicles.
Honda to Co-develop Refueling Port Connecting System for On-orbit Satellite Refueling with Astroscale
05/30/2025 | JCN NewswireHonda R&D Co., Ltd., a research and development subsidiary of Honda Motor Co., Ltd., will co-develop a refueling port connecting system designed for on-orbit refueling of satellites, with Astroscale Japan Inc., a subsidiary of Astroscale Holdings Inc.
Elbit Systems Expands Naval Defense Footprint with a Series of Recent Contract Wins
05/29/2025 | Elbit SystemsElbit Systems Ltd has recently been awarded several contracts by international customers including NATO member countries, underscoring the company’s growing role in strengthening naval defense capabilities for customers around the world.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
05/29/2025 | SiemensSiemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.