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Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams

05/21/2025 | Siemens
Siemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.

Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

05/20/2025 | Deca Technologies
Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.

ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging

05/15/2025 | BUSINESS WIRE
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform.

DuPont Unveils Brand Identity for Qnity, Future Electronics Spin-Off

05/15/2025 | PRNewswire
DuPont unveiled the branding of Qnity, the planned independent Electronics public company that will be created through the intended spin-off of its Electronics business*.

Koh Young Installs 24,000th Inspection System at Top 20 EMS

05/14/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
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