Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Will Gutierrez Joins Technica USA in West South-Central Territory

06/02/2026 | Technica USA
Technica USA is pleased to announce the hiring of Will Gutierrez as Business Development/Account Manager responsible for the West South-Central Territory. Will shall be responsible for all PCBA, Substrate and PCB related sales activities and customer support throughout Texas, Oklahoma, Arkansas and Louisiana operating from the state of Texas.

The AI Tipping Point: Transforming Global Material Supply Chains

06/01/2026 | Marcy LaRont, I-Connect007 Magazine
While the AI revolution has the world focused on the promise of solving our most complex challenges, some laminate and PCB fabricators are raising concerns that the high-performance materials used to build AI data centers will gobble up the precious resources needed to produce them. PCB industry expert Mark Goodwin, COO of Ventec International, a laminate and equipment supplier, has expressed his concerns about the critical shortage of glass and copper, which he believes will worsen.

Global Electronics Association Acquires New Venture Research EMS Program

05/27/2026 | Global Electronics Association
The Global Electronics Association has acquired New Venture Research’s EMS market intelligence program and released new data showing the global EMS market has returned to growth. The move expands the Association’s Industry Intelligence platform at a moment when it is investing more heavily in advocacy, market insight, and stakeholder communications for a global electronics industry it says exceeds $6 trillion and includes more than 3,000 member companies.

Managing DDR4, DDR5, and HBM Supply Challenges

05/26/2026 | Rob Ronan, Retronix Ltd.
The global electronics industry is no stranger to supply chain disruption, yet memory devices, particularly DRAM and NAND flash, sit at the center of a uniquely persistent challenge. The situation is particularly complex because constraints are not isolated; they are occurring simultaneously across both legacy and next-generation memory technologies. From DDR4 shortages driven by supplier exits to DDR5 demand being pulled by AI infrastructure, the market is facing a perfect storm of reduced supply, shifting demand, and aggressive pricing increases. For OEMs, EMS providers, and high-reliability sectors, this is a serious operational challenge.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in