Connect the Dots: Proactive Controlled Impedance
Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
December 23, 2024 | U.S. Department of CommerceEstimated reading time: 2 minutes
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on August 16, 2024, and the completion of the Department’s due diligence. This funding will support TI’s investment of more than $18 billion through the end of the decade to construct three new state-of-the-art facilities, including two in Texas and one in Utah. The Department will distribute the funds based on TI’s completion of project milestones.
“Shortages of current-generation and mature-node semiconductors were one of the driving forces behind supply chain disruptions during the pandemic, fueling innovation and putting our national security at risk,” said U.S. Secretary of Commerce Gina Raimondo. “With this major investment in TI to expand U.S. capacity of these foundational semiconductors, we are strengthening our economic security, making our country safer, and creating thousands of jobs in Texas and Utah.”
“Today’s final agreement with Texas Instruments continues to expand production in the U.S. for the foundational chips that power all electronic systems,” said Natalie Quillian, White House Deputy Chief of Staff. “The Biden-Harris Administration continues to onshore semiconductor manufacturing at a rapid pace, with over $32 billion invested catalyzing over $400 billion private funds to date, strengthening America’s supply-chain resilience and creating tens of thousands of good-paying American jobs.”
TI is a leading global manufacturer of analog and embedded processing semiconductors and has played an important role in the U.S. economy for almost a century, creating the technological foundation for modern electronics through its invention of the first integrated circuit. Today, TI specializes in the production of current-generation and mature-node chips, also referred to as “foundational” chips, which are the building blocks for nearly all electronic systems, including power management integrated circuits, microcontrollers, amplifiers, sensors, and more. The projects are estimated to create more than 2,000 manufacturing jobs and thousands of construction jobs over time.
“As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable, low-cost 300mm semiconductor manufacturing capacity at scale,” said Haviv Ilan, president and CEO of Texas Instruments. “The increasing number of electronic devices in our lives depend on our foundational chips, and we appreciate the support from the U.S. government to make the semiconductor ecosystem stronger and more resilient.”
As stated in the CHIPS Notice of Funding Opportunity for Commercial Fabrication Facilities, CHIPS for America will distribute direct funding to recipients for capital expenditures based on the completion of construction, production, and commercial milestones. The program will track the performance of each CHIPS Incentives Award via financial and programmatic reports, in accordance with the award terms and conditions.
Share on:
Suggested Items
Insights Into a Differentiating Trade/Investment Global Strategy for Electronics
05/27/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s actions on global trade policies earlier this spring, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/23/2025 | Marcy LaRont, I-Connect007In the electronics manufacturing industry, the global PCB market is estimated to reach $86.5 billion by 2029, a 5.9% annual growth, per IPC’s Global Market Forecast, and the global new cycle is still being dominated by U.S. news. This week, we are talking about the status of the CHIPS Act and what the new tax and incentives bill does and does not include. We also take a minute for some marketing wisdom to shed light in a challenging and noisy market environment.
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.
OKI Launches 124-Layer Circuit Board Technology
05/22/2025 | Andy Shaughnessy, Design007 MagazineDuring PCB East, OKI Circuit Technology unveiled its latest innovation: a 124-layer printed circuit board. In this interview, “Dennie” Kazuo Kawahara, president of OKI Data Americas, and Eiichi Aki, sales and marketing specialist at OKI Circuit Technology, shared their insights into this feat. With plans for mass production starting in October, this board is designed for high-bandwidth memory applications, accommodating the demanding requirements of AI chips.
IPC Report Recaps Imperatives in Global Chip Race
05/19/2025 | IPCWith funding awards under the U.S. CHIPS and Science Act currently under review, IPC just shared a new Industry Intelligence Report focused on the issues and players involved.