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This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
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Saki to Highlight Advanced Inspection Innovation at 39th NEPCON JAPAN
December 23, 2024 | Saki CorporationEstimated reading time: Less than a minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at the 39th NEPCON JAPAN at the Tokyo Big Site Exhibition Center.
From January 22 to 24, visitors to the show will discover Saki’s state-of-the-art inline total inspection line solutions for Smart Factories and latest hard- and software innovations. Saki’s solutions will be on display in the “Electrotest Japan” exhibition area on Booth E13-52 (East Hall 2) as well as on Booth 66-55 (East Hall 7) in the “Power Device & Module Expo” area. The latest AXI model for power modules, the 3Xi-M200V3, will be presented with demonstrations in the “Power Devices & Modules EXPO” area.
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SEL, Puget Sound Energy Collaborate With Customers for Community Microgrid
03/09/2026 | SELPuget Sound Energy (PSE) and SEL have completed a joint microgrid project on Samish Island, Washington. The system provides reliable backup power for the community fire station, operating seamlessly during five islanding events in its first storm season.
Delta Thailand, Yarra Power Partner to Expand Product and Solutions Business in Thailand
03/09/2026 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited has signed a Memorandum of Understanding (MoU) with Yarra Power Co., Ltd., a provider of clean energy distribution and installation services, to broaden product, service, and system integration offerings in the Thai market.
IMI Reports FY 2025 Results, Delivering Strong Margin Expansion and a Return to Profitability
03/06/2026 | IMIIntegrated Micro‑Electronics, Inc. (IMI), a global leader in electronics manufacturing services, announced its full‑year 2025 financial results. The company delivered increased margins, stronger cash generation, and a return to profitability following two years of strategic restructuring.
YINCAE's TM230D Introduced: Innovative 3-in-1 Solderable Adhesive
03/06/2026 | YINCAEA breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.