The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Saki to Highlight Advanced Inspection Innovation at 39th NEPCON JAPAN
December 23, 2024 | Saki CorporationEstimated reading time: Less than a minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at the 39th NEPCON JAPAN at the Tokyo Big Site Exhibition Center.
From January 22 to 24, visitors to the show will discover Saki’s state-of-the-art inline total inspection line solutions for Smart Factories and latest hard- and software innovations. Saki’s solutions will be on display in the “Electrotest Japan” exhibition area on Booth E13-52 (East Hall 2) as well as on Booth 66-55 (East Hall 7) in the “Power Device & Module Expo” area. The latest AXI model for power modules, the 3Xi-M200V3, will be presented with demonstrations in the “Power Devices & Modules EXPO” area.
Share on:
Suggested Items
Hitachi Energy Wins Over EUR 2 Billion Oder from Amprion
12/23/2024 | Hitachi EnergyHitachi Energy has signed contracts totaling over 2 billion euros with German transmission system operator (TSO) Amprion to deliver four converter stations for two high-voltage direct current (HVDC) links that will support Germany’s clean energy transition.
Two Additional Boeing O3b mPOWER Satellites Successfully Communicating in Space
12/23/2024 | BoeingTwo more Boeing-built O3b mPOWER satellites are sending and receiving signals in space after launching from the Kennedy Space Center, Florida at 5:26 p.m.
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25
12/18/2024 | TrendForceAs the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.
ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
12/13/2024 | ROHMROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in