Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Qualcomm, Amazon Announce Multi-Generational AI Data Center Collaboration

09/14/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced a multi-generation collaboration with Amazon to enable customized silicon at scale for large-scale AI data centers, working together on AI inference.

Dr. Jennie Hwang to Deliver Two PDCs at SMTA International 2026

09/14/2026 | Dr. Jennie Hwang
Dr. Jennie Hwang to deliver two PDCs on “AI-Powered Manufacturing: From Fundamentals to Factory Impact” (PDC5) and “Mastering Intermetallics for Reliable Electronics” (PDC2) at the 2026 SMTA International Conference.

Rigetti Signs $100M U.S. Government Agreement for Quantum R&D

09/11/2026 | Globe Newswire
Rigetti Computing, Inc., a pioneer in full-stack quantum-classical computing, announced that its wholly owned subsidiary, Rigetti & Co, LLC, has signed a definitive agreement with the U.S. Department of Commerce for an award of $100 million in funding to accelerate superconducting quantum computing R&D.

RapidDirect Launches PCB Division to Integrate PCB and Mechanical Manufacturing

09/11/2026 | Globe Newswire
RapidDirect, a leading global provider of custom on-demand digital manufacturing, announced the official launch of its new Printed Circuit Board (PCB) division.

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in