Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Jabil Posts Strong First Quarter Results
December 27, 2024 | JabilEstimated reading time: 1 minute
Jabil Inc., reported preliminary, unaudited financial results for its first quarter of fiscal year 2025.
First Quarter of Fiscal Year 2025 Highlights:
- Net revenue: $7.0 billion
- U.S. GAAP operating income: $197 million
- U.S. GAAP diluted earnings per share: $0.88
- Core operating income (Non-GAAP): $347 million
- Core diluted earnings per share (Non-GAAP): $2.00
“I am very pleased with our first fiscal quarter results, which came in stronger than we anticipated driven by incremental strength in our Cloud, Data Center Infrastructure, and Digital Commerce end-markets. As a result, the team was able to deliver strong Core EPS and cash flow generation during the quarter,” said CEO Mike Dastoor. “We now anticipate approximately $27.3 billion in net revenue, with core operating margins of 5.4%. Core earnings per share now are expected to be $8.75. Importantly, for the year we continue to foresee robust adjusted free cash flow generation of $1.2 billion,” he concluded.
Second Quarter of Fiscal Year 2025 Outlook:
Net revenue: $6.1 billion to $6.7 billion
U.S. GAAP operating income: $183 million to $263 million
U.S. GAAP diluted earnings per share: $0.69 to $1.27 per diluted share
Core operating income (Non-GAAP) (1): $286 million to $346 million
Core diluted earnings per share (Non-GAAP) (1): $1.60 to $2.00 per diluted share
Core operating income and core diluted earnings per share exclude anticipated adjustments of $13 million for amortization of intangibles (or $0.11 per diluted share) and $20 million for stock-based compensation expense and related charges (or $0.18 per diluted share) and $70 million to $50 million (or $0.62 to $0.44 per diluted share) for restructuring, severance and related charges.
Fiscal Year 2025 Outlook:
Net revenue: $27.3 billion
Core operating margin (Non-GAAP): 5.4%
Core diluted earnings per share (Non-GAAP): $8.75 per diluted share
Adjusted Free Cash Flow (Non-GAAP): $1.2 billion
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.