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Why Principal Mineral Bought Isola: The Vision Behind the Acquisition

07/16/2026 | Marcy LaRont, I-Connect007
With a mission focused on strengthening domestic capacity for strategic minerals and materials critical to national security, energy, AI, defense, and next-generation manufacturing, Principal Mineral is working to address some of the most urgent vulnerabilities in today’s supply chain. Its recent acquisition of Isola Group adds a major electronics materials platform to that portfolio. In this interview, Principal Mineral cofounders Adam Johnson, CEO, and Wes Spurlock, COO, discuss why Isola matters and what it will take to rebuild resilient U.S. supply chains at an industrial scale.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

Below the Surface: Ceramic vs PCB: When ‘Good Enough’ Becomes System Failure

07/15/2026 | Chandra Gupta -- Column: Below the Surface
Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

NAMIB EW Payload Completes Rafale Test Flight

07/13/2026 | Globe Newswire
Dassault Aviation and Harmattan AI announced the successful execution of a collaborative in-flight engagement between a Rafale F4 and an unmanned aerial system equipped with the NAMIB payload, a new electronic warfare device jointly developed by both companies.
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