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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

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BASF, D-Wave Announce Completion of Proof-of-Concept Project, Demonstrating Benchmark in Manufacturing Efficiency

11/05/2025 | BUSINESS WIRE
D-Wave Quantum Inc., a leader in quantum computing systems, software, and services, and BASF, one of the world’s leading chemical companies, announced the completion of a joint proof-of-concept project that used a hybrid-quantum application to optimize manufacturing workflows in a BASF liquid-filling facility.

Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

11/05/2025 | Leo Lambert -- Column: Learning With Leo
High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.

Trouble in Your Tank: Understanding Interconnect Defects, Part 1

11/04/2025 | Michael Carano -- Column: Trouble in Your Tank
This month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.

High Density Packaging User Group Announces European Space Agency Membership

11/04/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.

New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”

11/05/2025 | I-Connect007
I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
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