Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
High Density Packaging User Group Announces European Space Agency Membership
November 4, 2025 | High Density Packaging User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
“I’m excited for the opportunity to participate to the HDP User Group and its comprehensive research activities,” said Stan Heltzel, Materials Engineer and PCB expert at ESA. “International collaboration across market segments is instrumental to address the technical challenges, combining complexity and functionality with reliability. I’m convinced that ESA can contribute with technological expertise and a wide stakeholder network to the HDP projects, and vice versa.”
“I am pleased to welcome the European Space Agency to HDP, joining the outstanding organization working on HDP User Group projects. Their expertise and understanding of the complex PCBs required for outer space, the harshest use environment. They will contribute significantly to guiding our advanced reliability assessment projects," said Larry Marcanti, Executive Director of HDP User Group.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Real Time with… IPC APEX EXPO 2024: The HDP User Group's Role in the Electronics Industry
05/22/2024 | Real Time with...IPC APEX EXPOBev Christian, a project facilitator from the HDP User Group, outlines the consortium's focus on new materials and reliability in the electronics industry, and their collaboration on non-proprietary projects. Key areas of interest include corrosion, PFAS, and lead-free solders. Bev also highlights the value of collaboration and mentions partnerships with other consortia. The HDP User Group welcomes interested individuals to get involved via their website.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.