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SMTA Hosts Ultra High Density Interconnect Symposium
December 31, 2024 | SMTAEstimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.
Designed for industry leaders, researchers, engineers, designers, and academics, the UHDI Symposium fosters collaboration and knowledge sharing on the latest advancements and challenges in Ultra HDI technology.
Key Topics:
- PCB Design for Ultra HDI
- Fabrication Techniques for Ultra HDI
- Assembly Considerations for Ultra HDI
- Reliability Testing and Qualification for Ultra HDI
As the semiconductor industry pushes the boundaries of miniaturization and performance, the UHDI Symposium provides a platform to explore:
- Emerging trends and innovations in Ultra HDI technology
- Strategies for overcoming design, fabrication, assembly, and reliability challenges
- Accelerating the transition from prototype to high-mix, low-volume manufacturing
- Don't miss this opportunity to connect with industry experts, gain valuable insights, and shape the future of Ultra HDI technology.
For more information, visit https://smta.org/mpage/uhdi/.
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08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
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TRI Unveils New Platform for Diverse Board Sizes
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The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
American Standard Circuits to Exhibit at IMS 2025
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