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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
December 31, 2024 | EIPCEstimated reading time: Less than a minute
The European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.
Over the two days the conference itself will cover an eclectic range of topics, including AI, a look at the car of the future, as well as a view of the business outlook for the industry. Plasma jet, manufacturing efficiency, new metallic finishes all get a look-in, delivered by many familiar faces.
The conference will also include a "Quick Fire Walk-In" session on Wednesday afternoon, focusing on standardization, sustainability, quality, and reliability.
Following the conference, attendees will have the opportunity to visit Circuit Foil, a leading company in the electronics industry.
Registration is now open. Please contact the EIPC team in The Netherlands to secure your place at this important industry event.
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EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
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SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.