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Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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TRI to Exhibit Advanced Test and Inspection at IPC APEX Expo 2025
January 1, 2025 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025. Visit TRI at booth #2905 to experience TRI's latest test and inspection solutions for the electronics manufacturing Industry.
TRI's lineup will include the enhanced 3D SPI TR7007Q SII and 3D AOI TR7700Q SII with a new optical configuration of a 21MP Camera and 9.8um Resolution. TRI will also highlight the latest multi-angle 3D AOI, TR7500QE Plus, for hidden solder joint defects. TRI will also showcase the High-Speed 3D Inline Automated X-Ray Inspection TR7600 SIII and the High-Resolution 3D CT AXI TR7600F3D SII. TRI's Optical Inspection Solutions are powered by AI-Algorithms and Metrology measurement capabilities.
The IPC APEX 2025 lineup also includes the Multi-core ICT TR5001Q SII INLINE with up to 4,096 test points and can handle boards of up to 510x510 mm in size. With over 35 years in the market, TRI Board Tester ATE Solutions range from MDA and Functional Tests to High-End High-Pin Count ICTs, making them ideal for Multiple Electronics Manufacturing Industries.
The AI-powered solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI solutions comply with the latest Smart Factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Visit TRI's booth No. 2905 at IPC APEX 2025 to discover why the top EMS businesses chose TRI as their Test and Inspection Partner.
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European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke
04/01/2025 | I-Connect007 Editorial TeamAs component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: We’ve Got It Covered
04/01/2025 | I-Connect007 Editorial TeamIPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage.
Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
03/31/2025 | Real Time with...IPC APEX EXPONeil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.