-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Hon Hai Research Institute Publishes AI-Driven Silicon Carbide Technology in IEEE OJPEL
January 1, 2025 | Hon Hai Technology GroupEstimated reading time: Less than a minute
Hon Hai Technology Group announced that its Semiconductor Research Institute has successfully combined AI learning models with reinforcement learning to accelerate the research and development of silicon carbide power semiconductors. This breakthrough research, published in the esteemed IEEE Open Journal of Power Electronics (OJPEL), demonstrates the significant potential of AI in advancing third-generation semiconductor technology.
By leveraging reinforcement learning, Hon Hai Research Institute has optimized the process parameters and component design of silicon carbide materials. This approach allows for more efficient and accurate predictions, reducing the need for extensive trial and error in the development process. The research team successfully applied this method to the design of protective rings for high-voltage and high-power silicon carbide components, achieving significant improvements in performance.
Silicon carbide power semiconductors are crucial for high-power applications such as electric vehicles, smart grids, and aerospace systems. Hon Hai's research advances the capabilities of these critical components, enhancing their stability and reliability for demanding applications.
Moving forward, Hon Hai Research Institute will continue to integrate AI with semiconductor research and development, driving innovation and expanding the applications of high-power components.
Suggested Items
Analysts: 54 Trends That Will Shape the Technology Market
01/03/2025 | ABI ResearchAs 2025 kicks off, predictions abound on the technology innovations expected in the year ahead. In its new whitepaper, 101 Technology Trends That Will—and Won’t—Shape 2025, analysts from global technology intelligence firm ABI Research.
Zhen Ding Kaohsiung AI Park Obtained the Investment Approval by the Southern Taiwan Science Park Bureau
12/30/2024 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported, obtained the investment application of its subsidiary in Kaohsiung Al Park approved by the Southern Taiwan Science Park Bureau.
Mourning at AT&S: Farewell to Hannes Androsch
12/30/2024 | AT&SOn December 11, Dr. Hannes Androsch passed away at the age of 86. AT&S is losing its Chairman of the Supervisory Board – and so much more. When Dr. Hannes Androsch took over AT&S, the Styrian printed circuit board company, from Austrian Industry Holding AG (ÖIAG) with Willibald Dörflinger and Helmut Zoidl back in 1994, AT&S had 939 employees.
2025 Will See Significant Growth in AI Spending, But Gen AI Will Not Create Expected Value
12/31/2024 | ABI ResearchAs 2025 kicks off, predictions abound on the technology innovations expected in the year ahead. In its new whitepaper, 101 Technology Trends That Will—and Won’t—Shape 2025, analysts from global technology intelligence firm ABI Research.
$100M Investment Will Propel Absolics, Georgia Tech’s Advanced Packaging Research
12/30/2024 | Georgia TechAs part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP), three advanced packaging research projects will receive investments of up to $100 million each.