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Altus Highlights Heller Industries Advances in Void Reduction Under 1%
January 6, 2025 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability. As one of their key suppliers, Heller Industries, a global provider of electronic manufacturing reflow solutions, has developed multi-stage controlled vacuum technology that reduces void rates to below 1%. This technology is especially beneficial for industries like semiconductor and surface-mount technology (SMT) assembly, where maintaining high-quality solder joints is crucial.
With the increasing demand for high-performance electronics, reducing voids in solder joints is essential for ensuring long-term reliability. Heller’s vacuum-assisted reflow soldering process has proven to significantly reduce void rates by up to 99% while addressing substrate and wafer warpage, critical challenges for the electronics manufacturing industry.
Heller’s vacuum technology creates a controlled vacuum environment during the reflow process, allowing gas bubbles to escape, reducing void formation. This results in improved heat dissipation, better product stability, and enhanced performance, particularly in high-frequency applications. Additionally, the technology helps eliminate solder splatter and prevents solder bridging, further improving manufacturing efficiency.
Joe Booth, CEO of Altus Group, said: "We are lucky to have suppliers that are dedicated to developing solutions that make a real difference for our customers and voiding is top of mind for many globally. Heller's multi-stage controlled vacuum technology advancements are a perfect example of a supplier addressing a trend, offering manufacturers a way to improve solder joint quality and eliminate issues like voiding whilst mitigating warpage. By helping customers optimise their reflow soldering processes, we’re enabling them to achieve higher quality products and more efficient operations.”
Heller’s vacuum-assisted reflow technology, now widely implemented across customer installations in production, offers manufacturers a cost-effective solution with high efficiency and low unit per hour (UPH) rates, making it ideal for optimising production without compromising quality.
Altus in partnership with Heller are a significant force in the electronics manufacturing industry, helping manufacturers address key convection reflow process related challenges. Through its ongoing collaboration with Heller Industries, Altus is supporting over 200 manufacturing sites in the UK using Heller to improve process reliability, product quality, and operational efficiency, further reinforcing its role as a trusted industry partner.
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Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability
12/11/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. Designed with Type 7 powder for aperture sizes down to 60μm, it enables fine-feature printing in advanced system-in-package applications.
Altus Reports Growing Demand for Guidance on Convection Reflow Oven Specification
12/10/2025 | Altus GroupAltus Group, a leading distributor of electronics manufacturing equipment in the UK and Ireland, has reported a rise in enquiries from manufacturers looking for guidance on specifying convection reflow ovens for SMT production lines.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Indium to Feature Thermal Materials Solutions for High-Performance Computing at SC25
11/13/2025 | Indium CorporationAs one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and other high-reliability products at The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC25), taking place November 16-21, in St. Louis, Missouri.
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.