-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium
January 6, 2025 | American Standard CircuitsEstimated reading time: 2 minutes

Anaya Vardya, president and CEO of American Standard Circuits, announced that his company’s Director of Quality/Advanced Technology, John Johnson, will be speaking at this year’s Ultra HDI Symposium, Jan. 23, in Peoria, Arizona.
Johnson’s talk, "It Depends: Ultra HDI Fabrication Methods and Trade-Off's," will cover the fabrication methods for ultra HDI printed circuit boards and design considerations for various options. American Standard Circuits is one of the industry’s leaders when it comes to the engineering and fabrication of ultra HDI PCBs and Johnson is an expert on the topic.
As a long-time industry innovator, Johnson has a great deal of experience in the engineering, quality management and fabrication of PCBs. He is currently leading ASC's charge into the technological future of printed circuit boards
Mr. Johnson will also participate in the panel discussion, "Bridging the Gap: Accelerating Ultra HDI Adoption through Collaboration," alongside other industry leaders including:
- Chrys Shea, Shea Engineering
- Gayle Towell, AIM Solder
- Gerry Partida, Summit Interconnect
- Paul Cooke, AGC Multi Material America
- Stephen Chavez, Siemens
The event will also spotlight:
- Lab-to-Fab Updates: Key insights and forward-looking action items stemming from SMTAi 2024 Ultra HDI Learning Pavilion discussions.
- Miniaturization in Assembly: Solutions to the growing challenges shrinking feature sizes.
- PCB Fabrication Breakthroughs: New materials, processes, and equipment transforming Ultra HDI.
- DFM & Signal Integrity: Strategies for optimizing design with ultra-thin PCB materials and ensuring signal integrity, with a focus on DFM’s role for both fabrication and assembly.
- Future Technologies: A look at emerging innovations LCP with 10-micron embedded traces and sub-5-micron features on next-generation materials.
Industry leaders will come together to exchange ideas and drive the future of Ultra HDI. It’s a do not miss opportunity to stay ahead in a rapidly evolving field.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Suggested Items
Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance
03/05/2025 | Globe NewswireThis MoU marks a significant step forward for Tata Electronics, Himax, and PSMC in expanding their market outreach and jointly exploring the growing market of display semiconductors and ultralow power AI sensing in India as well as globally.
AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China
02/19/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center.
Nordson Electronics Solutions Introduces ASYMTEK Select Coat SL-1040 Ultrasonic Cleaning Station for Maintaining Conformal Coating Equipment
02/13/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces their latest technology innovation for conformal coating systems, the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station (patent pending) to keep nozzles and needles clean, and prevent clogging during production
UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
02/06/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.
AMETEK Acquires Kern Microtechnik
02/04/2025 | PRNewswireAMETEK, Inc. announced the acquisition of Kern Microtechnik, a leading manufacturer of high-precision machining and optical inspection solutions.