Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

RTX's Raytheon Completes Design Review of Landsat Next Space Instruments

05/19/2026 | RTX
Raytheon, an RTX business, has successfully completed the preliminary design review for NASA's Landsat Next Instrument Suite (LandIS).

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.

H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator

05/18/2026 | Siemens
Siemens has announced that H2 Core Systems, a startup focused on modular hydrogen-based energy systems, is using the Siemens Xcelerator platform of software and automation portfolio to design and manufacture compact, highly efficient hydrogen energy systems that generate and store clean energy where it is needed.

Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in