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SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
January 7, 2025 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging. The facility’s prototyping research will be operated by the National Semiconductor Technology Center (NSTC), and its advanced packaging research will be operated by the National Advanced Packaging Manufacturing Program (NAPMP).
“Today’s announcement is a welcome step forward for U.S. leadership in semiconductor innovation, marking significant progress in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. The new Arizona facility will benefit from – and build upon – the state’s already-strong semiconductor fabrication and advanced packaging ecosystem.
“For America to remain the world’s technology leader, it must continue to lead in semiconductor innovation. Driving forward U.S. research in chip prototyping and advanced packaging is critical to keeping America on top in chip technology. We look forward to continuing to work with leaders in Washington to ensure the CHIPS and Science Act’s R&D initiatives and manufacturing incentives remain on track to deliver big benefits for America’s economic strength, national security, and global competitiveness.”
The NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility will combine state-of-the-art manufacturing and packaging and next-generation technology development to provide NSTC members and NAPMP funded researchers with 300mm research, prototyping, and packaging capabilities. Co-locating the NSTC research and development prototyping and NAPMP packaging capabilities in a single facility will provide the domestic semiconductor ecosystem with unique value to conduct collaborative semiconductor and advanced packaging research.
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