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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/19/2025 | Nolan Johnson, I-Connect007
We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.

STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France

09/17/2025 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.

Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary

09/16/2025 | Futurum
Advanced packaging is becoming the cornerstone of AI semiconductor scaling, with 2.5D/3D integration, CoWoS, CPO, CoPoS, and SoW-X set to drive major gains in performance, bandwidth, and efficiency through the 2020s.

I-Connect007 Launches Advanced Electronics Packaging Digest

09/15/2025 | I-Connect007
I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.

Global Interposer Market to Surge Nearly Fivefold by 2034

09/15/2025 | I-Connect007 Editorial Team
Revenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
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