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MBDA Makes Roxel a Wholly-owned Subsidiary
January 7, 2025 | MBDAEstimated reading time: 1 minute
MBDA has integrated Roxel as a wholly-owned subsidiary of its European defence group, having acquired the 50% share held by Safran on 19 december 2024. This acquisition leverages Roxel’s existing and future capabilities at a time of major growth and investment.
Roxel will continue to manage its activities independently, honouring all its existing contracts with other systems suppliers while developing new markets, particularly for export. This acquisition will accelerate the development of Roxel, strengthening its position as a global player in tactical propulsion and consolidating its role as a national champion in France and the UK.
MBDA CEO Éric Béranger hailed the operation: “I welcome everyone from Roxel to the MBDA Group. By reinforcing the work interactions and cooperation between the teams of the two companies,, this transaction is to support Roxel’s operational and industrial excellence. It also aims to provide an even more optimal response to the ramp-up challenges posed by the context of war economy, both in development and in production."
Roxel CEO Sylvie Grison added: “This acquisition will enable us to further develop innovation in new solid propulsion technologies. Additionally, this integration operation will make it easier to optimise industrial cycles for faster ramp-up. I am therefore very pleased that this share acquisition has been completed.”
Roxel is a Franco-British firm formed from the merger of Celerg and Royal Ordnance Rocket Motors in 2003. As a European leader and a major global player in its field, Roxel designs, develops, manufactures and supplies solid propulsion systems and associated equipment for all types of tactical and cruise missiles and rockets for air, naval and land forces. Roxel has four production sites (one in the UK, one in the Nouvelle-Aquitaine region and two in the Centre-Val de Loire region) as well as offices in the Paris region.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Standard of Excellence: Speed vs. Quality in Customer Service
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TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
American Standard Circuits Launches 50th 77-Second Webinar
10/27/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits/ASC Sunstone Circuits is pleased to announce that they have recently unveiled their 50th 77-second webinar.