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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IPC K-FEST 2026 Brings AI, Manufacturing and Standards into Focus

11/06/2026 | Global Electronics Association
Organized by the Global Electronics Association with support from Korea Testing Laboratory (KTL), the fourth IPC Korea Festival of Electronics Standards and Technology (IPC K-FEST 2026) took place in Seoul on November 3.

North American EMS Orders Climb Despite Lower September Shipments

10/28/2026 | Global Electronics Association
The Global Electronics Association announced the September 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.68.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

EMS Plugs in to Capitol Hill

10/12/2026 | Daniel Baker, director, policy communications & public affairs, Global Electronics Association
Trick question! Electronics manufacturing services (EMS) companies turn parts and components into the systems and products that power every sector of today’s economy, including agriculture and healthcare, to autos and the F‑35.
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