Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Marcy LaRont Named I-Connect007 Executive Director
January 8, 2025 | IPCEstimated reading time: 1 minute
Marcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022. She succeeds Barry Matties, publisher and original founder of the I-Connect007 publications, who will continue on in an advisor capacity.
As executive director, LaRont will oversee the operations of all I-Connect007 publications and events.
LaRont began her career in PCB fabrication in the 1990s shortly upon graduating from college, learning the business organically from working in small and mid-sized manufacturing companies and plants. She previously worked for the I-Connect007 team as part of the sales group from 2007-2011.
LaRont describes coming back to the team and the industry as coming home. “I am thrilled to have the opportunity to lead this group and am excited about the future. As is true with the electronics manufacturing industry, media has also undergone continuous change over the past several years. Barry’s insight and vision have always allowed I-Connect007 to adapt and thrive with those changes. I look forward to continuing in that tradition as we examine all that our media and marketing outlets must be for our industry and our customers.”
Adds Brian Knier, IPC vice president of marketing and member success, “This is truly the end of an era. With the I-Connect007 group of publications, and CircuiTree magazine before that, Barry Matties succeeded in creating the go-to, best media source for news and information related to the electronics manufacturing supply chain worldwide. But with the end of every era, comes a new one. Marcy’s expertise in electronics manufacturing, communication, marketing and management enable her to be a strong voice for global electronics manufacturing. IPC is thrilled to welcome her to the role of executive director.”
LaRont can be reached at MarcyLaRont@ipc.org or Marcy@iconnect007.com.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.