Dan’s Biz Bookshelf ‘House of Huawei'
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
Facing the Future: Challenges and Opportunities in Reshoring PCB Manufacturing
American Standard Circuits’ Anaya Vardya to Keynote PanPac Summit 2025
January 9, 2025 | American Standard CircuitsEstimated reading time: 1 minute
The Pan Pacific Strategic Electronics Symposium (PanPac) has announced that Anaya Vardya, President and CEO of American Standard Circuits (ASC), will deliver the keynote address at this year’s conference. Hosted by the Surface Mount Technology Association (SMTA), PanPac 2025 will take place from January 27-30, 2025 at the Sheraton Maui Resort & Spa in Maui, Hawaii.
PanPac aims to foster relationships and build bridges across cultures, industries, technologies, companies, and individuals. The conference’s location in Hawaii is designed to create an atmosphere free from distractions, encouraging focused face-to-face interactions.
Mr. Vardya, a long-time industry innovator and leader, will deliver his keynote address on Tuesday, January 28. His presentation titled “Ultra High-Density Interconnects (UHDI): A Global Innovation in Electronics Assembly” will highlight American Standard’s groundbreaking work in UHDI printed circuit board (PCB) engineering and design. As the industry leader in UHDI technology, ASC continues to set new standards for innovation and excellence.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes
06/03/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.