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Nolan’s Notes: Emerging Trends in 2025

01/06/2025 | Nolan Johnson -- Column: Nolan's Notes
January is a traditional time to mark changes in our lives. A new year can signal new beginnings. But change is constant. So, as we flip over the calendar into 2025, we look at what’s ahead for the EMS supplier industry. What are your concerns and challenges? What trends are emerging? What can you expect from a new administration?

SMTA Hosts Ultra High Density Interconnect Symposium

12/31/2024 | SMTA
The Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.

Happy’s Tech Talk #35: Yields March to Design Rules

12/12/2024 | Happy Holden -- Column: Happy’s Tech Talk
Ultra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”

The Shaughnessy Report: A Stack of Advanced Packaging Info

12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.

Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing

12/05/2024 | Real Time with... electronica
Michael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.
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