The Pan Pacific Strategic Electronics Symposium (PanPac) has announced that Anaya Vardya, President and CEO of American Standard Circuits (ASC), will deliver the keynote address at this year’s conference. Hosted by the Surface Mount Technology Association (SMTA), PanPac 2025 will take place from January 27-30, 2025 at the Sheraton Maui Resort & Spa in Maui, Hawaii.
PanPac aims to foster relationships and build bridges across cultures, industries, technologies, companies, and individuals. The conference’s location in Hawaii is designed to create an atmosphere free from distractions, encouraging focused face-to-face interactions.
Mr. Vardya, a long-time industry innovator and leader, will deliver his keynote address on Tuesday, January 28. His presentation titled “Ultra High-Density Interconnects (UHDI): A Global Innovation in Electronics Assembly” will highlight American Standard’s groundbreaking work in UHDI printed circuit board (PCB) engineering and design. As the industry leader in UHDI technology, ASC continues to set new standards for innovation and excellence.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
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