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Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation

05/06/2026 | I-Connect007
I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.

ASC’s John Johnson Bullish on the U.S. and High-tech PCBs

04/28/2026 | Marcy LaRont, I-Connect007
It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.

SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation

04/14/2026 | Marcy LaRont, I-Connect007
The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
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