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Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups

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Multilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.

Big Ideas Take the Stage: APEX EXPO 2026 Keynotes

02/25/2026 | Michelle Te, I-Connect007
Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.

INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect

05/30/2025 | iNEMI
One of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.

Driving Innovation: Registration in PCB Production Throughout the Process

05/06/2025 | Simon Khesin -- Column: Driving Innovation
PCB manufacturing is a fascinating industry where multiple disciplines—chemical, mechanical, and optical processes—intersect. Each field plays a crucial role, and missing even one step can significantly impact production and yield. In the realm of mechanical and optical processes, one of the most critical aspects influencing the final result—especially in complex PCB designs—is registration.

Counterfeit Electronics & Materials Symposium Program Announced and Registration Open

03/19/2025 | SMTA
The SMTA is excited to announce the technical program for the Counterfeit Electronics & Materials Symposium. The symposium will be held 15-16 April 2025 at AFC Wimbledon in London, England.
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