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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Data Paints a Picture—Can You See It?
January 9, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Andrew Kelley is CTO of Xact PCB, a company founded by engineers with firsthand experience in PCB fabricators. Xact PCB has developed a cutting-edge system to monitor and predict the registration of inner layers through advanced registration control systems. By leveraging data collected from various production stages, Xact PCB’s GX tool enhances precision. It minimizes errors, ensuring that the final products meet their customers' exact specifications while eliminating the need for costly pilot lots.
Marcy LaRont: Andrew, tell me about Xact PCB.
Andrew Kelley: We provide registration control systems for PCB manufacturers, but we all started in PCB manufacturing. Our engineers were making printed circuit boards, living with the manufacturing problems day in and day out. Our software product was a solution we spun into a commercial product many years ago. Since then, we've been installing it worldwide. The system monitors the registration of the inner layers at various points in the process. It learns from the information it picks up and combines that with information about the materials and processes used, enabling it to make predictions for future designs. It will predict how the different layers will move during processing to give you counter artwork scales, so the final product is exactly the nominal size required for the end customer.
LaRont: It is advantageous to your product development that your core group came out of physically making the boards. Explain Xact PCB’s approach to improving inner layer registration through these smart tools.
Kelley: The core point for any measurement system has been an X-ray drill process system post-lamination, which unfortunately means any errors on the board are already fixed in the board. You can't change them, but you can learn from them. However, as long as the layers line up, you can counter any subtle scale errors by then adjusting the drilling process, the next imaging process, and so on. The X-ray drill is probably the core point from which all our systems users would begin.
To read the entire interview, which originally appeared in the December 2024 issue of PCB007 Magazine, click here.
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03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
Big Ideas Take the Stage: APEX EXPO 2026 Keynotes
02/25/2026 | Michelle Te, I-Connect007Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
Driving Innovation: Registration in PCB Production Throughout the Process
05/06/2025 | Simon Khesin -- Column: Driving InnovationPCB manufacturing is a fascinating industry where multiple disciplines—chemical, mechanical, and optical processes—intersect. Each field plays a crucial role, and missing even one step can significantly impact production and yield. In the realm of mechanical and optical processes, one of the most critical aspects influencing the final result—especially in complex PCB designs—is registration.
Counterfeit Electronics & Materials Symposium Program Announced and Registration Open
03/19/2025 | SMTAThe SMTA is excited to announce the technical program for the Counterfeit Electronics & Materials Symposium. The symposium will be held 15-16 April 2025 at AFC Wimbledon in London, England.