-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Real Time with… IPC APEX EXPO 2025: Schmoll America Showcasing Four Advanced Machines
March 5, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Kurt Palmer, president of Schmoll America, talks about the past first pivotal year for his company since becoming a separate entity last April. Schmoll America has expanded its team and enhanced its capacity to support customers across North America, with a focus on hiring both experienced and promising new talent. Dedicated to innovation and excellence, Schmoll America is committed to providing fast, reliable support and customized solutions for PCB manufacturers. In an expansive booth, Schmoll America is showcasing three advanced Schmoll machines and one from Impex, its partner company.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/04/2025 | Nolan Johnson, I-Connect007There was big news throughout the week on a global economic scale. Everything is moving so fast it’s hard to follow. I sat in on a webinar about the U.S. tariff changes announced on April 2, and even the policy wonks, whose life’s purpose is to be expert in these things, couldn’t keep up. One speaker was checking government information websites, and listening to the news on the television even as she gave her update.
Raymond E. Pritchard IPC Hall of Fame Award: Peter Bigelow
04/04/2025 | Nolan Johnson, I-Connect007IPC’s most prestigious award honors an individual’s long-term distinguished service and contributions to IPC and the electronics manufacturing industry. Peter Bigelow is president of FTG Circuits in Haverhill, Mass., focusing on the military, RF/microwave, and aerospace markets. He also has extensive experience in general management, marketing, operations, and sales with large publicly traded and privately held manufacturing companies in the printed circuit, electronics, and instrumentation industries.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
My Top 10 Highlights from IPC APEX EXPO 2025
04/03/2025 | Chris Mitchell, IPC VP, Global Government RelationsEvery year, I am reminded what an exciting and fast-paced whirlwind IPC APEX EXPO is—the friends you run into, the new people you meet, the innovations you encounter, and the fascinating discussions you dive into. It’s certainly true that our industry is driven by searchers and problem-solvers, creating endless opportunities at APEX EXPO to connect, collaborate, and shape the future.
Real Time with... IPC APEX EXPO 2025: MivaTek is Revolutionizing Circuit Board Manufacturing with DART Technology
04/02/2025 | Real Time with...IPC APEX EXPOBrendan Hogan from MivaTek Global discusses the company's focus on direct imaging for circuit boards and semiconductors. MivaTek is introducing DART technology for dynamic feature size adjustments. This technology enhances precision, improving registration and throughput.