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One Design, Many Minds: From Concurrent to Co-design

06/23/2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.

Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation

06/17/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.

Schneider Electric, Foxconn Ink Strategic Collaboration to Accelerate Next-gen AI Data Centers

06/15/2026 | Globe Newswire
Schneider Electric, a global energy technology leader, announced a strategic collaboration with Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, to help define and scale the next generation of AI data centers.

Infineon, Siemens Deploy Silicon Carbide Technology to Modernize Electrical Protection

06/09/2026 | Infineon
Infineon Technologies AG and Siemens AG are partnering to advance electrical protection and ensure reliable operations in data centers, production facilities and battery storage systems.
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