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Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600FB SII system, designed to deliver clearer imaging.
The new X-ray imaging structure design addresses diverse product layouts and is optimized for specialized substrates, BGAs, multilayered structures, SiP, IC, CSP, Flip-Chip, and many more.
The TR7600FB SII is the ideal choice for inspecting critical components on the top that need to be imaged with high resolution. The system allows the tube to get exceptionally close to the bottom side without structural interference, ensuring precise imaging even when components are on the top and the bottom is clear of obstacles.
TRI is the only AXI provider offering top (TR7600F3D Series) and bottom (TR7600FB Series) tube solutions. As tube-side clearance is limited at high resolutions, TRI can address multiple applications depending on the customer’s product layout.
The X-ray inspection platform can inspect large boards up to 850 mm x 520 mm and up to 12kg in weight. The TR7600FB SII is capable of inspection with resolution ranges from 5 – 30 µm, ensuring defect detection for multiple industry applications, such as Aerospace, Advanced Packaging, Automotive, Data Center, IIOT, Medical, and Mobile Devices.
The Smart 3D AXI prioritizes usability and integrates AI into key inspection processes. Operators can quickly and efficiently set up and manage inspection programs thanks to the intuitive interface and AI-assisted programming. The TR7600FB SII supports Inline fine-tuning for multiple samples without interrupting production.
The 3D AXI integrates with Smart Factory production lines and the MES of your choice, ensuring compatibility and future-proofing your production processes. The newly released AXI supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
