The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
SAMI-AEC Showcases Cutting-Edge Technological Solutions at IKTVA 2025
January 13, 2025 | SAMIEstimated reading time: 2 minutes
SAMI Advanced Electronics Company (SAMI-AEC), a subsidiary of SAMI, is proud to announce its participation in the “IKTVA Forum and Exhibition 2025,” the region’s leading event for energy sector supply chains. Held under the patronage of HRH Prince Saud bin Nayef bin Abdulaziz, Governor of the Eastern Province, and organized by Saudi Aramco from 13 to 16 January 2025 at Dhahran Expo in Dammam, the event aims to support the growth of the local manufacturing sector and enhance its global competitiveness.
At the exhibition, SAMI-AEC will showcase its innovative and diverse solutions across the security, defense, and energy sectors. Among the featured technologies is the Data Diode, a device that offers unparalleled protection for sensitive and isolated data in critical sectors such as military, oil and gas, water, electricity, and other key infrastructure. The device ensures 100% prevention of data leakage through its unique design, which restricts data flow to a single direction.
SAMI-AEC will also present the “Raqeeb S4” smart site safety solution, powered by artificial intelligence. This advanced tool enhances workplace safety by enabling real-time data analysis and rapid response in construction sites and other work environments. Another highlight is the Under Vehicle Scanning System (UVSS), which uses AI-driven technology to generate high-resolution images of a vehicle’s undercarriage, ensuring it is free of security threats. Additionally, the company will unveil the eBariq long-range, multi-engine, hybrid-powered aircraft, featuring an ultra-durable carbon fiber body and the capability to carry heavy payloads.
Eng. Ziad Al Musallam, CEO of SAMI-AEC, expressed pride in participating at “IKTVA 2025,” stating: “Our presence at IKTVA 2025 underscores our commitment to driving innovation, enhancing local content, and strengthening the energy sector’s supply chain to achieve global excellence. This event provides a strategic platform to showcase advanced technologies that meet the growing needs of the energy sector while improving operational efficiency across various industries.”
He added, “Aligned with Saudi Vision 2030, our solutions contribute to the development of a robust technical infrastructure that drives digital transformation, strengthens the national economy, and cements Saudi Arabia’s position as a global innovation leader.”
The In-Kingdom Total Value Add (IKTVA) program reflects Aramco’s commitment to creating value across its operations. By advancing local content, enhancing supply chain capabilities, and fostering collaboration among energy sector stakeholders, IKTVA supports Saudi Arabia’s transformation into a major global export hub, in line with Vision 2030.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.