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Advanced Electronics Packaging Digest

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Suggested Items

PCB Technologies to Exhibit at IMS 2026 in Boston

06/05/2026 | PCB Technologies Ltd.
Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and high-frequency electronics industry, taking place June 7th through June 13th, 2026, at the Thomas M Menina Convention and Exhibition Center in Boston, Massachusetts.

Technica USA Welcomes ASMPT Support Team for SIPLACE SX Demo Days Event

06/05/2026 | Technica USA
Technica USA, in partnership with ASMPT, hosted a successful Demo Days event this week at its San Jose facility.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/05/2026 | Marcy LaRont, I-Connect007
It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

Fujitsu, Daiichi Life Launch Joint Research on Quantum-Powered Asset Management

06/04/2026 | Fujitsu
Fujitsu Limited and Daiichi Life Group, Inc. announced that they conduct joint research from April 2026 to March 2027 to advance asset management operations through the application of quantum technology in the insurance sector.

Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0

06/04/2026 | Global Electronics Association
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package.
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