Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
January 16, 2025 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
The presentation, High Reliability and Low-Temperature Solder Solutions for AI and Automotive Application, will explore cutting-edge solder solutions designed to meet the demanding requirements of the evolving automotive and AI industries. Modern automotive electronics require robust solder solutions that can withstand extreme temperatures while maintaining long-term reliability. Meanwhile, AI applications demand solders compatible with High-Performance Computing (HPC) requirements, where thermal management during processing is critical.
Additionally, Chou will discuss Indium Corporation's innovative Durafuse® LT and Durafuse® HR solder technologies. These solutions address two critical industry challenges: the need for high-reliability solder joints in high-temperature automotive environments and low-temperature processing solutions for complex AI computing modules.
“As the automotive and AI industries continue to push the boundaries of electronic performance, traditional solder solutions are no longer sufficient,” said Chou. “Durafuse® technology represents a significant breakthrough, offering solutions that handle both the intense heat of automotive applications and the precise, low-temperature requirements of AI processing.”
Chou is Indium Corporation’s senior area technical manager for the company’s customers in Taiwan, with a focus on the semiconductor industry. His strategic location in southern Taiwan provides timely customer response, as well as efficient sales and marketing team support. Chou has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology.
Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Visitors can view the presentation on Thursday, January 23, at 3:00 p.m. in East Hall 7.
Suggested Items
Europlacer Expands U.S. Reach with New Eastern Region Representative
06/30/2025 | EuroplacerEuroplacer, a global leader in flexible SMT assembly solutions for High-Mix manufacturers, is pleased to announce the appointment of Photo Chemical Systems as its new representative for the Eastern United States.
TrustPoint Launches Third Satellite and Successfully Establishes First Contact
06/26/2025 | BUSINESS WIRETrustPoint, a pioneer in next-generation space-based positioning and navigation solutions, is proud to announce the successful launch and first contact of its third free-flying satellite, Time Flies, aboard the latest rideshare launch out of Vandenberg Space Force Base on Monday.
CEE PCB Appoints KT Technical Solutions as North American Sales Representative
06/23/2025 | CEE PCBStrategic Partnership Expands CEE PCB’s Reach into the North American Market with a Focus on Customer-Centric Service and High-Quality Manufacturing
Silicon Mountain Implements Vorne XL Production Monitoring System to Boost Efficiency and Visibility
06/19/2025 | Silicon MountainSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, announced the recent implementation of the Vorne XL real-time production monitoring system.
Scanfil Signs New Customer and Starts Manufacturing Control Units for Emerson
06/19/2025 | ScanfilScanfil and Emerson signed an agreement concerning the Rosemount Tank Radar for Advanced Level Measurement Solutions. Emerson is a global technology, software and engineering company domiciled in the USA.