Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
January 16, 2025 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
The presentation, High Reliability and Low-Temperature Solder Solutions for AI and Automotive Application, will explore cutting-edge solder solutions designed to meet the demanding requirements of the evolving automotive and AI industries. Modern automotive electronics require robust solder solutions that can withstand extreme temperatures while maintaining long-term reliability. Meanwhile, AI applications demand solders compatible with High-Performance Computing (HPC) requirements, where thermal management during processing is critical.
Additionally, Chou will discuss Indium Corporation's innovative Durafuse® LT and Durafuse® HR solder technologies. These solutions address two critical industry challenges: the need for high-reliability solder joints in high-temperature automotive environments and low-temperature processing solutions for complex AI computing modules.
“As the automotive and AI industries continue to push the boundaries of electronic performance, traditional solder solutions are no longer sufficient,” said Chou. “Durafuse® technology represents a significant breakthrough, offering solutions that handle both the intense heat of automotive applications and the precise, low-temperature requirements of AI processing.”
Chou is Indium Corporation’s senior area technical manager for the company’s customers in Taiwan, with a focus on the semiconductor industry. His strategic location in southern Taiwan provides timely customer response, as well as efficient sales and marketing team support. Chou has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology.
Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Visitors can view the presentation on Thursday, January 23, at 3:00 p.m. in East Hall 7.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Element Solutions Declares Q3 Dividend of $0.08 Per Share
08/22/2025 | BUSINESS WIREElement Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India
08/14/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.