Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
January 16, 2025 | TopLine CorporationEstimated reading time: Less than a minute
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
MRQW provides a forum for discussing issues in all areas of microelectronics reliability and qualification for high-reliability and commercial applications. TopLine recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers and next generation applications including Very Large 2.5D Packages. The Microelectronics Reliability and Qualification Workshop (MRQW) won the topic, which will be addressed by Hart, including the application of braided solder columns to aerospace applications and extreme environments.
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Advint Delivers Advanced Electroplating Training to Triangle Labs
06/02/2025 | Advint IncorporatedDuring the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.