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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
January 16, 2025 | TopLine CorporationEstimated reading time: Less than a minute
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
MRQW provides a forum for discussing issues in all areas of microelectronics reliability and qualification for high-reliability and commercial applications. TopLine recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers and next generation applications including Very Large 2.5D Packages. The Microelectronics Reliability and Qualification Workshop (MRQW) won the topic, which will be addressed by Hart, including the application of braided solder columns to aerospace applications and extreme environments.
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